Blame All Machine 40 Nm Dram Maker Delayed The War Situation
40 nm DRAM industry, the global war appears variable
, as immersion machine (ImmersionScanner) deferred delivery of it, Ray crystal has been let go, said the original plan by the end of its 80 000 12? Wafer production capacity to turn into all 45 Chennai Metric-term objectives, will be officially deferred to 2011 Q1, the first one sets immersion machine will officially arrive this week, later than the scheduled duration of 2 to 3 months, internal has decided to 80000 turn into full production of 63 nanometer process as a contingency. All approved the DRAM industry, the global DRAM industry for 40 nm vs. time official will be in 2011!
Rui-Jing Chen Zhengkun General Manager, said Ray crystal 1 has immersion machine will officially arrive this week, is expected in September there will be 5 to 6 units before the immersion machine in, turn will be accelerated into the 45-nanometer process speed.
Chen Zhengkun further pointed out that Samsung Electronics (SamsungElectronics) the 40 nm technology generations ahead again, is Taiwan-based DRAM factory US-Japan trade have met with the same bottleneck, most of which are stuck in the machine deferred immersion delivery of it.
Disclosed under the DRAM industry, Samsung started back in early 2009 scheduled immersion machine, together with Toshiba (Toshiba), TSMC and other semiconductor manufacturers in the 50 nm process, also need immersion machines in 2009, Taiwan Department of DRAM factory also caught in a quagmire because the financial gap, and now the situation facing deferred machine, only reluctantly accepted.
However, the Swiss crystal to compensate for the progress of the deferred 45-nanometer process, the internal decision also its 80,000 capacity all turn into 63-nanometer process? A transfer only part of the original internal plans, the other a direct jump from the 65-nm 45-Chennai meters, but the basis for development of the situation now, Switzerland has decided to speed up the whole grain transferred into 63-nanometer process, to catch up with the second half of personal computer (PC) the traditional peak season.
Chenzheng Kun said that the current 63 nanometer chip has started a lot of investment is expected in June, 30% of output would be 63 nanometer products, in July will be transferred across the board? 3-nanometer process, such as in the second half in place of immersion machine after another , will then gradually turn into the 45-nanometer process.
Rui Jing originally planned end of 2010, its 12? Fab capacity will be 80,000 full round and round into the 45nm process, but because immersion machine delivery time than expected at 2 to 3 months, so After internal evaluation, by the end of 80 000 full transfer target 45nm not touchdowns, will be deferred one quarter and are expected to 1st quarter of 2011 will complete the whole turn.
In addition, the PSC in the second half will join the 45-nanometer process war, the production of cast films and the approximate time at a quarter of grain than the Swiss.
Nanya and Inotera in the camp is concerned, is still scheduled in the second half will be transferred into the 42-nanometer process, this technology is Micron (Micron) and Nanya joint research and development.
Furthermore, the Korean system manufacturers in the 40 nanometer generation processes progress, the situation is still the present leader, Samsung and Hynix (Hynix) will turn into 46 nanometer and 44 nanometer process, a large number of shipments is expected in the second half, However, the real 40-nanometer generation of global warfare, time is in 2011, when the appearance of a mainstream product is the capacity of 2Gb DDR3 chips.
Blame All Machine 40 Nm Dram Maker Delayed The War Situation
By: blairzhang
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