SiP and known good substrate

SiP and known good substrate

SiP and known good substrate

The System-in-Package technology, in nutshell, is an advanced technology that is used for the incorporation of multiple components into a single package. With the use of system in package technology, you can minimize a module size to a much better compact smaller sizes, that is, you can mix the CPU, logic and memory functions hence reducing the overall size to a great extent.

For a SiP technology to be a complete success, the known good substrate turns out to be a highly contributing factor. For instance, substrates are present that uses HDI laminate technology. A choice of a known good substrate is the key factor governing the proper implementation of the SiP technology in various fields. Another suitable example of the use of known good substrates is that of the one used by Toshiba's package on package stacking solutions. This system uses a 4 layer build up substrate to integrate their components and services.

Mobile phones and other portable devices, which are usually generally small in size and have space limitations, find the system in package technology to be a satisfying one for their needs. The SiP performs almost all functions of an electronic system, and their reduced size is a result of vertical stacking of system components, in compact fashion on the best suitable substrate.

The known good substrate performs its high durable functionality with the of HDI laminate technology. It is essential that you sort out the best substrate for your system to ensure that you don't end up with a wrong choice with low performance factor. Essentially, silicon substrate technology is found to be a promising one with their qualities like high density reconnect, which accounts for the huge gap between front end scaling, interconnect pitch and substrate scaling.

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