Types Of Chemical Heater, Interesting Facts About Silicon Nitrite Etch Process

If you are aiming for a good career in the semiconductor or wet process industry

, there are a lot of things you need to be familiar with, including terms that are not common to many people. In this article, I am sharing particularly about some interesting facts about the silicon nitride process and the types of chemical heater.

Types of chemical heater

Quartz - Gas Heater - a system that is designed to meet the growing demand for heated high purity gasses. It has the capacity of heating a wide range of gases including: Ammonia (NH3), Helium (He), Argon (Ar), Hydrogen (H2), Arsine (AsH3),Hydrogen Bromide (HBr), Boron Trichloride (BCl3),Hydrogen Chloride (HCl), Carbon Dioxide (CO2), Nitrogen (N2),Carbon Monoxide (CO), Chlorine (Cl2), Nitrous Oxide (N2O), Oxygen (O2),Disilane (Si2H6), Sulfur Dioxide (SO2),Methylsilane (SiH3CH3).

Quartz - Fluid Heater - used in the semi-conductor industry. Its traditional application includes recirculation loop, either as the sole head source or a combination of a heated quartz tank.

SiC - HF & KOH Heater - designed for heating HF (hydrofluoric acid), KOH (potassium hydroxide), and other high PH chemistries. It uses high purity Silicon Carbide (SiC) as a heat transfer material as it has excellent heat transfer properties and eliminates the risk of contamination due to Teflon breakdown.

The Silicon Nitride Etch process - some interesting facts

To achieve the greatest etch rates and best selectivity, the phosphoric acid should have the highest ratio of water at a given temperature. For as long as the boil point is maintained, the etch rate of both Si3N4 and SiO2 can be precisely controlled.

Maintaining a boiling solution is one of the challenging tasks in the etch process. When phosphoric acid is heated, the water solution begins boiling off. When temperature is not maintained, it affects the etching process as the acid concentration increase. Wet etch companies use a standard temperature controller to maintain temperature, but the water concentration will decrease and will change the etch rates. To address this issue, wet etch process engineers utilize "water addition system".

A technology called closed "reflux" system is used and it is created above the bath using condensing collar and a lid this is to minimize water addition.

The chemical fumes and high temperatures that Nitride Etch tanks are subjected to are known to reduce bath life substantially by attacking the sealant that prevents liquid and fumes from entering the heater area.

Quartz Nitride Reflux system is designed to address the unique needs of the silicon nitride etch process. It gives the benefits of process uniformity, lot-to-lot repeatability, and stratification prevention.

by: Riza Deshpande

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