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subject: 3D Chip, Powerful Leading Power [print this page]

3D Chip, Powerful Leading Power
3D Chip, Powerful Leading Power

Areyoua3Dmoviefan?Ifso,thereisgoodnewsforyou.

Withthesuccessof3DmovieslikeAvatarandwiththeincreasinginterconnectdensitiesandincreasingcostofICmanufacturinginleadingedgetechnologynodes,3DarchitecturesforICintegrationandpackagingarebecomingviablealternativestothestandard2Ddesigns.

Recently,JapaneseelectronicsgiantSharpunveiledalineof3Dtelevisions.Thisisanexampleofthefactthat3DTVhasbeenoneofthebiggesttechnologystoriesoftheyearsofarandhasapromosingfuture.

Thefastdevelopmentof3DTVcontributestotheaccelerationof3Dchips.

Interestingly,3Dtechnologyisemergingasnumerousotherparadigmsinsilicontechnologyandsystemdesignareshifting.

Oneofthebasicadvantagesof3Dstructuresistheimprovedvolumetricdensityaswellasallowingtheconnectionsbetweenthecomponentstobeshorter.

This,inturn,allowsthoseconnectionstobefasterandmorepowerefficient.Atthesametime,3Dtechnologyprovidesimprovedinterconnectivitywiththeincreasednumberofneighborsinbothlateralandverticaldimensions.

Today,alargenumberofacademicgroupsandcompaniesareinvolvedin3Dresearch.Verticallyintegratedchipshavebecomeavailablecommerciallyinembedded,wireless,andmemorydevices.

Systemsinthesesectorshavestrictareaandvolumelimitations.

Hence,shrinkingthechipfootprintdelivershighvalueinthecorrespondingmarkets.

Themicroprocessorsectorwilllikelybenexttoadopt3Dintegration,butthevaluepropositionisclearlydifferent,withthefocusonimprovedinterconnectivity,packagingdensity,memorylatency,andbandwidthimprovementaswellasheterogeneousintegration.

RelatedICfor3Dchipis:TC4S66F.

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