Smart phones and other portable electronics devices require wireless connectivity module design. This is not as simple as it sounds. Basically it is important to have wireless capabilities in many slimline devices. There is an ever increasing demand for these products. Take the iPhone for example, this is an extremely slimline design which has many different features for its users. It connects to the internet, plays games, makes calls, and takes photographs.
Smartphones like the iPhone are now using 3G and even 4G internet connections. This means that wireless connectivity module design has had to be updated. In order to fit such a wireless module into a small electronics device, special technology has been developed. This is called System-in-Package (SiP). The system in package approach basically houses all of the different components of the device in a single package.
The demand for system in package has created a technology which is actually superior to previous circuit board design. It is all around more efficient. Less power is used, the design is less complex, there is a faster time-to-market, and costs are lowered. This means that new products can be developed and released faster than ever before. It was only a few years ago that wireless connectivity modules had to be placed in a different area to other components, for example the antenna.
This SiP design now allows for all of these components to be stacked vertically in one small package. These packages are usually less than the 1.6 mm thick. Obviously this allows for ultra slimline products to be developed. This technology is proving to be so efficient that it will soon be incorporated into many different electronic products. The wireless revolution is just beginning and wireless connectivity modules will soon be integrated into most electronic devices.
