subject: Production And Technology Related With Printed Circuit Board Assembly [print this page] After the completion of the PCB, electronic components are added with it to produce a operational PCB assembly. There are certain simple steps by which one can easily prepare such a device. The steps are Stencil selection, Screen Printing, SMT part placement, SMT Reflow, Throughthrough hole assembly, Wave and/or hand soldering and Testingtesting. All the steps performed while assembling will go through a series of inspections. The testing is done at the completion of process and can be of various types like electrical, visual, AOI, or functional testing.
There are two distinct approaches utilized to prepare the printed circuit board assemblyPCB assembly. The first one of them is known as the Through-hole technology. In this method, pins are used which are connected to the electrical components, which are finally pushed inside the holes of the circuit board. After the board is properly installed, the component is made fixed with the help of other set of pins which are joined to the other side. This method provides high degree of precision and was extremely popular earlier. This was completed by efficient labors that were able to solder the components following very tiny details with accuracy.
There is another approach of PCB assembly which is called the Surface-mount technology (SMT). This technology has been invented in recent times and has almost put the through-hole method in the backyard. In this case, the components are directly mounted overhead the PCB. To fix the components a special technique is applied which is known as mechanized reflow oven soldering technique. This new technology has been a boon for the production as it can save both time and money significantly.
After the completion of the production of the printed circuit board assemblyPCB assembly, it's tested repeatedly to provide the buyers only quality goods. In power-off mode, it's tested for strength of soldering, visual and optical inspections and analog signature; whereas in power-on mode, testing is done for its voltage and frequency measurements.
