China Semiconductor Packaging Market Overview - Semiconductor Packaging - Electronics Industry

China Semiconductor Packaging Market Overview - Semiconductor Packaging - Electronics Industry

Order to reduce production costs, international Semiconductor OEM manufacturers and packaging and testing companies have transferred production of its package to China, thereby directly driving the Chinese semiconductor packaging industry, the rapid expansion of the scale. At the same time, China Chip The expanded scale of chip manufacturing and the huge and rapidly growing terminal Electronic Application markets has greatly promoted the growth of China's semiconductor packaging industry. Both effects, resulting in the semiconductor packaging industry in China despite Financial Impact of the crisis, but the global semiconductor market, the importance of packaging has become increasingly prominent.

The global financial crisis on China's economy has a huge influence, in 2008 China's economic growth rate reached a seven-year low power, annual growth rate of only 9% in the fourth quarter growth rate of 9% from third quarter dropped to 7%. The continuing financial crisis affected the global consumer buying behavior, resulting in the shrinking market of electronic devices. This has a direct impact on China's semiconductor market conditions, because more than 80% of China's packaging revenues from overseas markets. According to data from the China Semiconductor Industry Association said in 2007 China's semiconductor Sell Increased by 24%, while the packaging industry increased by 28%. Then in 2008 the decline have emerged:

China's semiconductor sales fell 0.4%, mainly in very serious decline in the fourth quarter (compared to the third quarter, down 20%)

Compared to China's semiconductor packages fell -1.4% in 2007, mainly from the depth of decline in the fourth quarter (compared to the third quarter fell by 56%)

Semiconductor packaging semiconductor industry chain is an important part, so far, more than 200 companies compete in the packaging field, though many are producing products with low pin count for small businesses. In the early industrial development, China's foreign investment and joint venture enterprises are mainly concentrated in the IC packaging and testing package has a relatively mature product in the low pin count. However, with foreign investment and joint ventures will be advanced packaging production lines to China to package substrate ( IC Substrate)-based products appeared to grow rapidly. Ball Grid Array package (BallGridAllay), Chip Scale Package (ChipScalePackage), wafer level packaging (WaferLevelPackage) and system in package (System-in-Package) will become mainstream. Wafer Bumping package (WaferBumping) has also begun to take shape. Perforated silicon technology (ThroughSiliconVia) has been applied in image Sensor (CMOSImageSensors) on and has been in volume production. In support of the Government's special funds, local packaging companies are quick progress of technology. Jiangyin Changjiang Electronics, Nantong Fujitsu, Tianshui Huatian were listed. Three of its leading IC packaging and testing enterprise sales as shown below

Yangtze River Delta region IC packaging and testing industry is still the most promising areas. However, in order to reduce costs, in recent years a number of IC packaging and testing companies have chosen to create a new factory in central and western regions. Part of the integrated device manufacturers and foundry IC packaging and testing companies will shift production to central and western regions, this trend will continue for several years.

China's semiconductor packaging materials market in 2009 to more than 2.2 billion U.S. dollars, more than 1% increase in 2008. Is expected to reach 3.1 billion by 2011. In 2004, China's semiconductor packaging materials market for the 800 000 000 76 million U.S. dollars. From 2004 to 2011 the average annual compound growth rate of 20%, mainly from the rapid growth in the packaging substrate.

Semiconductor packaging materials market in China

2004 to 2011 compound annual growth rate (CAGR) of 20% of the main engine of growth from the substrate, high-end packaging materials still rely mainly on imports. In the lead frame section, added several high-end products for the production line etching, however, leading local enterprises and overseas enterprises in the technology gap remains huge. In recent years, begun to replace copper wire gold wire, copper wire diameter of more than 2mil used and low pin count products. More than 90% (in meters) of copper is applied to discrete devices and power devices (with lead frame as the substrate). Copper substrates used in packaging process has also been in volume production. On the packaging plant, the lower packaging material costs and improve production efficiency is the main effective way to reduce costs, especially for the packaging substrate, lead frame and bonding wire and other material parts, packaging material suppliers will face the future more than 20% price cut pressure.

Packaging equipment market in China in 2008 reached 452 million U.S. dollars. Affected by economic crisis, the Chinese packaging equipment market in 2009 is expected to decline about 34%, to 300 million U.S. dollars. With the rapid growth of packaging equipment market, some of the leading equipment manufacturers in China set up a production line. However, local packaging equipment accounted for less than 15% market share in China and is mainly used in low-end market.

POST COMMENT

74th China Electronics Fair (autumn. Shanghai) - China Electronics Fair - Electronics Industry Detail Information On Radiology Assistant The Electronic CV (eCV) – Career Guidance and Career Advice for the electronic CV Intel chip plant in Dalian office buildings in use - Intel, the chip - the electronics industry Parental Control-The Ultimate safety for your Child Boosting The Safety Of Your Home With Certain Improvements Starting an Internet Radio Station- Get Help Tracking The Different Uses Of Electronic Digital Signatures send free electronic christmas cards Five Steps To Buying Electronics Radios One Of The Important Communication Device Fireplace Safety Should Be a Top Priority Permanent Foundations & Federal Manufactured Home Construction and Safety Standards (CFR 3280)