Electronic Packaging And Smt Are Parallel Or Cross? - Electronic Packaging, Smt, Component - The

Present, packaging technology from the connection position

, the general assembly production technology to achieve a high degree of diversification of the gradual evolution of electronic information equipment, a key technology. Higher density, smaller bumps, lead-free process and so need a new packaging technology to meet Consumption The rapidly changing electronics market demand characteristics. The packaging technology innovation, has become Semiconductor And electronic manufacturing technologies continue to develop a pushing hand, and the former Road, semiconductor technology and surface mount (SMT) technology to improve production with a significant impact.

If the flip Chip Bump generation semiconductor process backward Road package before the Road extension, then, based on silicon wire bonding bump generation is the packaging process forward Road extension. Is not difficult to observe, for the components, systems or Machine Multi-Chip Module (MCM) packaging technologies, completely changed the concept of packaging is only for devices, as MCM technology is a PCB , Hybrid circuits, SMT and semiconductor technology in a collection of, so we can keep the device is called a system of physical prototypes.

In the electronics industry, the new packaging technology is driving the industry change, market integration has emerged in active and passive components, analog and digital circuits, or components of the package containing the power modules, which the traditional separation technical means are mixed together, is making back-end component package and front-end assembly integration into a trend. New packaging technology to promote the back-end component mount technology assembly processes and the gradual integration of front-end process is likely to lead to an SMT production process innovation.

Can say that component is the driving force of SMT technology, while also driving advances in SMT chip packaging technology continues to improve. Chip components is applied first, the largest output surface mount components, ever since the SMT formed, the corresponding IC Package was developed for the short-lead or leadless SMT the LCCC, PLC C, SOP structure. Four-side pin flat package (QFP) to achieve the use of SMT in PCB or other substrate surface mount, BGA pin pitch QFP solve limit problems, CSP is a general trend to replace QFP already, but the bottom flip chip bonding Filler Technology is also widely used in CSP devices.

With 01,005 components, high-density CSP package widely used to install components from the current 0.15mm pitch to 0.1mm development, which will inevitably determine the SMT process from the device to meet the fine will be towards the assembly of applications development. But the SiP, MCM, 3D the emergence of such new package, making the production of today's electronics manufacturing process problems is increasing. Since the complex multi-chip module package physical design, size or a certain standard pin-out is not, which led Although the new package can meet the market of new products time to market and functional requirements, but the technological innovation of Queshi SMT has become complex and the corresponding increase in assembly costs.

Can be expected, with the passive components and IC, and all embedded in the substrate within the 3D package ultimately, wire bonding, CSP ultrasonic welding, DCA, PoP (stack assembly technology), also will enter the board-level assembly processes range. Therefore, SMT, if not quickly adapt to the new package technology development will be difficult to sustain.

Order to meet the back-end component package and front-end assembly of the fusion trend, packaging industry and their equipment suppliers and SMT manufacturers and equipment manufacturers only between closely Cooperation Can really meet the consumer demand for the electronic age. Decided by the process equipment and configuration, which is China Electronics Future development trend of the manufacturing sector. China's semiconductor packaging is stage of rapid development of electronic industry's expansion has slowed momentum. In this context, to enhance packaging and assembly industry, technology exchange and collaboration, will promote China's semiconductor packages, electronic assembly sector continued to play an active role in high-speed development. Regrettably, the current domestic packaging and electronic assembly will be properly linked to the exchange platform is rare.

2007 for the first time will combine packaging and electronic assembly to communicate "CHINASMTFORUM" aroused the concern of the industry.

by:gaga

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