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Through Rich Micro



Since the beginning of the year, Electronic Industry maintain high momentum in the economy, and as automation, labor and production requirements increase, the domestic market has begun warming, the future of long-term development of space. Technology flow in this current economic market, the performance will be more prominent.

Through rich micro-power: IC IC packaging and testing technology leader

IC packaging and testing industry, technological progress embodied in the form of changes in packaging, BGA, CSP is the major growth market; IC packaging and testing the level of profits depends on product mix. To package division, high-end product gross margin of 25% -30% can be achieved, only 10% of low-end.


Electronics Components The current cyclical upward, IC revenues to grow substantially. Tong Fu Microelectronics which received orders last year, up 22%, a record high production.

2010 first quarter, the company's revenue 388 million yuan, up 100.12 percent; operating profit of 32.82 million yuan, net profit of 30.13 million yuan, up 2829.5% year on year. Substantial growth year on year results, due by the first quarter of last year Financial Turmoil low base.

Class IC design companies this year, the economy has improved significantly over the previous year degree, through the rich use of micro-power "to order to determine production" mode, the maximum packaging business in order to make full production run, but also to enhance a comprehensive margin.

The first quarter of this year's report shows that the rich micro-power management costs through an increase of 62.96%, mainly for R & D investment, and combined with past practice, point of view, the R & D results achieved quite good.

Through rich micro-power as the first successful development of BGA products of local enterprises, new products already in production, high-end BGA products can be used in mobile phones and other SD card devices.

Last year, successfully developed the advanced packaging technology, access to the central large subsidies to achieve scale production this year. Central government subsidies 132 million yuan, the "advanced packaging process development and industrialization," the project will be 75 million over three years, "the key packaging and testing equipment, materials, application engineering, project validation," the project was 57 million yuan will be two years.

The technology also complies with international companies to divest part of IC packaging and testing operations, or transfer to the Chinese-made trend. Plus the overseas shareholders, Fujitsu marketing advantage through rich micro electric customers in this business resources to achieve leadership.

And because the introduction of high-end packaging business, product structure began to upgrade production efficiency, gross margin reached 17.07% in 2009, an increase of 2.16%. The new sub-process: open a new era of domestic electronic manufacturing

China Electronics (quotes, information, comments) process industry development opportunities, mainly from the industrial upgrading and independent innovation in depth. At the same time, the electronics manufacturing industry specialization, leading to the refinement of the division of labor. To improve product quality while reducing production costs, the more extensive electronic manufacturing outsourcing phenomenon, which facilitate the electronic manufacturing industry.


Currently focused on the supply of electronic manufacturing companies in small, new sub-process is a strong comprehensive strength, providing electronic manufacturing system solutions and more than 5000 kinds of products for the elections involving electronic equipment, Chemical industry Accessories and so on.

Based on historical annual reports, the new sub-processes operating income in 2006-2008 was 2.19 billion yuan, 304 million yuan, 3.71 billion yuan, up 39.26%, respectively, 23.82%.

Through Rich Micro

By: dpdp
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