Toshiba Appear The Barrage Of A 128-gigabyte (gb) Anchored Nand Beam Anamnesis Module

Toshiba appear the barrage of a 128-gigabyte (GB) anchored NaND beam anamnesis module

Toshiba america Electronic Components, Inc. (TaEC) and its ancestor aggregation Toshiba Corporation* afresh appear the barrage of a 128-gigabyte (GB)(1) anchored NaND beam anamnesis module, the accomplished accommodation yet accomplished in the industry(2).Toshiba is the aboriginal aggregation to accomplish in accumulation sixteen 64Gbit NaND chips, and activated avant-garde dent abrasion and layering technologies to apprehend alone chips that are alone 30 micrometers thick.

The bore is absolutely adjustable with the latest e-MMC standard, and is advised for appliance in a avant-garde ambit of agenda customer products, including smartphones, book PCs and agenda video cameras. They accommodate a ambassador to administer basal ascendancy functions for NaND applications, and are accordant with the JEDEC e-MMC Version 4.4 and its new Pa3475U-1BRS features. New samples of 64GB chips will aswell be accessible from august.

Demand continues to abound for ample body chips that abutment high-resolution video and bear added storage, decidedly in the breadth of anchored memories with a ambassador action that abbreviate development requirements and affluence affiliation into arrangement designs.

New Product Line-up

Product Number

Capacity

Package

Sample Shipment

Mass Production

THGBM2T0DBFBaIF

128GB

237Ball FBGa

17x22x1.4mm

Sept. 2010

4Q, 2010

(Oct.-Dec.)

THGBM2G9D8FBaIF

64GB

237Ball FBGa

17x22x1.4mm

aug. 2010

4Q, 2010

(Oct.-Dec.)

Key appearance

The JEDEC e-MMC V4.4 adjustable interface handles capital functions, including autograph block management, absurdity alteration and disciplinarian software. It simplifies arrangement development, acceptance manufacturers to abbreviate development costs and acceleration time to bazaar for new and upgraded products.

The 128GB Pa3478U-1BRS accessory endless sixteen 64Gbit chips bogus with leading-edge 32nm action technology. appliance of avant-garde dent thinning, layering and wire bonding technologies has accustomed Toshiba to accomplish alone chips alone 30 micrometers thick, and to band and band them in a baby package. The aftereffect is an anchored beam anamnesis bore with the industry's accomplished density.

The new articles are closed in a baby FBGa amalgamation alone 17 x 22 x 1.4mm and has a arresting blueprint adjustable with the JEDEC e-MMC V4.4.

more : VGP-BPS9/B , VGP-BPS9/S , VGP-BPS9a




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