Integrated passive device design is used for creating feature rich portable electronics like mobile phones. The technology which has been developed to create wafer thin designs is called System in Package. This technology allows for multiple components to be placed in a single package. This includes inductors, resistors and capacitors. Antennas and wireless connectivity modules can now be housed in a single unit which promotes ultra slim designs.
Previously components were placed side-by-side on a circuit board which used up more space and more power. The latest integrated passive devices designing means that everything is more efficient as less space and power are used. This SiP technology is also less complex than the previous method. This means a quicker time to market and lower development and testing costs.
Portable hand held electronics devices such as mobile phones rely on different methods of data transfer. An integrated passive devices might contain a Bluetooth low energy module as well as an antenna (AiP), and wireless connectivity module. SiP technology allows for all of these components to be located in the same package. This of course saves power and space.
Devices such as these are always evolving which is why SiP technology is so important. Previous technologies can be reused and built upon to incorporate new integrated passive device designs. For example recently 4G internet has been introduced, it is now a much simpler process to integrate space onto the substrate.
One major benefit of these new technologies is that fewer companies are required to create new products. Previously there was multiple testing in that field. The less complex design of these technologies means that outsourcing and subcontracting is no longer necessary. These improved levels of efficiency will eventually transfer into larger electronic products too, as wireless data transfer becomes more in demand.