There is always a demand for smaller and more portable electronics devices. This has become more of a concern for the semiconductor design experts in the past 20 years. It all began with the invention of personal computers. Everybody should remember the enormous creations that companies like IBM first made. There was a need then to create computers which could be played used in the home, and that has continued to laptops.
System in package technologies use multi-chip module design methods to help create ever smaller products nowadays. It is no longer good enough to have a 17 inch laptop for people, they now want them even smaller.
Multi-chip module (MCM) design allows for circuit boards and RF design components to be included in a very small packages. This has allowed for the tiniest computers ever to be made which feature many different components. The most obvious example of that in 2011 is the mobile phone, radio components and much more all within a single package, called SiP design.
MCM technology has allowed for slimline designs of smart phones like the iPhone to be made. The design process used in this technology is less complex than previous computer systems. This means that new development is faster than ever before. At the same time the costs are lower as less power used.
The SiP approach to circuit board and RF design has been so successful that it is now being applied to different, larger devices. We have entered the wireless age and this is why this technology is so important. Ultra small components are housed together in one package. The design phase is fast and less complex. This means there are lower costs and there is a faster time-to-market for new products.